Bronkhorst
Application note

Using mass flow controllers for nitrogen purge (FOUP)

Semiconductor companies use advanced technology to manufacture chips on silicon wafers for different applications and devices such as telecom, gaming, industrial, etc. factories are all over the world. Today's advanced technology requires better flow control of gases in the production process to increase production and reduce the cost of using these gases. Bronkhorst works with leading semiconductor industry suppliers of OHB Gas Box, Load Port and related equipment, whose equipment is a major component integrated into every semiconductor process tool.

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FOUP

An Overhead Buffer (OHB) is used to temporarily store wafers in a FOUP box (Front Opening Universal Pod) while waiting for the next process step. The Load Port (loading/unloading module) is used to load silicon wafers into semiconductor processing tools, and cleanliness is an important factor in ensuring high yields of silicon wafer production. Since the cleanliness of the manufacturing environment is one of the main factors affecting product yield, the performance of wafer handling and storage equipment is a critical process in semiconductor manufacturing. Optimal wafer handling/storage processes minimize moisture, particles, and oxygen that can cause semiconductor wafer metal to oxidize or lose conductivity.

Important topics

  • Accuracy and consistent repeatability of Mass Flow Controllers
  • Cost reduction by optimizing products to meet customers' specific needs
  • Reduced the footprint of the equipment by customizing the body of the equipment design
  • Improved cleanliness through controlled and traceable manufacturing methods


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Process solution

Monitoring and control of an ultra-high purity (UHP) N2 (A) / clean dry air purge (B) is the main function of the mass flow controllers in the process. In older fabs, the clean dry air purge (B) is more commonly used whereas new fabs use UHP N2 purge (A).

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